Application area

This equipment is mainly used for 3D imaging detection of tin ball and various pin tips: ortho position, coplanarity, ball diameter, pin size, etc. it can output various reports for customers to keep;

Advantage
*Mature detection algorithm software, has passed the verification;
*The software parameters are customized and open, and the measurement benchmark is customized;
*The light source system is stable and reliable, specially designed for tin ball detection;

main parameter

1. Production rate: 1.5-15 s / PCS (depending on product)

2. Detection function: alignment (x0. Y0. C0) adjacent (Cx. Cy. LC)

3. Resolution: 3.5 um

4. Repeatability: 5 um

5. Three dimensional benchmarking correlation: ± 15um

6. FOV size: 25 x 25 mm - 60 x 60 mm (splicing)

Machine parameters

Case introduction

Detect solder ball pin & nbsp; The resolution accuracy can reach um level

Software introduction

Repeatability data of Coplanarity Measurement

Report on the relativity of the position degree of solder ball

Data of pin position