Application area

This equipment is mainly used for the detection of bad bubbles in the infrared sensor chip, automatic scanning code binding chip, and discharging bad bubbles. Equipped with special microscope light source and high-speed focusing detection algorithm, it can accurately locate the chip target less than 30um for image detection, and output various reports and images by docking MES;

Advantage
*A special magnifying microscope can be used to accurately photograph and analyze micro chips;
*The software parameters are customized and open, which can adapt to different material numbers;
*The light source system is stable and reliable;
*Mature detection algorithm software, has passed the verification;
*SMT carrier board connection online detection;

Main parameter
1. Detection function: detect whether there are bubbles in chip sensor sensor, chip missing, etc
2. Detection efficiency: 1.5s/pcs (UPH 2400pcs)
3. Resolution: 0.5 um
4. Magnification: optical 10x-50x (total magnification X400, can detect various micro components)
5. FOV size: 0.3 x 0.3 mm

Case introduction
The surface of infrared proximity sensor is covered by excessive polycarbonate, which has a great influence on the sensitivity of the sensor
Before, the sensor can be detected only after the assembly, so the rework cost is high.
Automatic chip bubble detection equipment to solve this problem, each sensor before assembly online full inspection, to prevent the outflow of defective products!